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High Density SIM CARD package IC substrate
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Zhuhai Fillgold Technology Co., Ltd.
4 yrs
CN
Key attributes
Other attributes
Place of Origin
China
Brand Name
N/A
Model Number
UO-21015A-A
Targrt products
PBGA,FBGA,FMC,SIP,MCP,FCCSP,POP,FCBGA,LGA,etc
Core material
MGC,Doosan,LG,Hitachi,Sumitomo,AMC
SR material
Taiyo,Hitachi,Sumitomo,SanEI
Pattern
Tenting,MSAP,PSAP,ETS,SAP
Soldermask
PSR series
Surface Finish
E'tro-Ni/Au ENIG,ENEPIG OSP(AFOP) Hard Au
Warranty
1 year
Size
Customized
MOQ
20 strips
Brand
No brand
Type
LOGIC ICS
Packaging and delivery
Port
shenzhen
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Lead time
Quantity (square meters)
1 - 200
> 200
Lead time (days)
30
To be negotiated
1 - 9 square meters
$9.00
>= 10 square meters
$0.10
Quantity
-
+
Shipping
Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
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