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2g 3g OPP bag package HY610 thermal grease thermal compound for cpu heat sink
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Shenzhen Halnziye Electronic Co., Ltd.
14 yrs
CN
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Key attributes
Industry-specific attributes
CAS No.
9003-07-0
Other attributes
Place of Origin
Guangdong, China
Main Raw Material
Silicone
Usage
CPU Cooler
Other Names
Polypropylene
MF
C3H6
EINECS No.
200-338-0
Classification
Other Adhesives
Brand Name
Halnziye
Model Number
HY610
Type
Thermal grease
Thermal Conductivity
3.05W/m-k
Thermal Inpedance
0.073
Specific Gravity
2.33 g/cm3
Viscosity
70 Pa s
Thixotropic Index
350 1/10 mm
Operation temperature
-30~220 ℃
Color
Gold
Description
OPP package HY610 thermal paste
Applications
CPU/VGA/GPU heat sink
Packaging and delivery
Packaging Details
can package/mini package/soft tube package/syringe package/blister package/OEM&ODM package
Port
Shenzhen&Hongkong
Supply Ability
Supply Ability
10000 Piece/Pieces per Week
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Customization
Customized logo
Min. order: 2000
Customized packaging
Min. order: 2000
Graphic customization
Min. order: 2000
For more customization details,
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Shenzhen Halnziye Electronic Co., Ltd.
14 yrs
Located in CN
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Product descriptions from the supplier
Minimum order quantity: 20 pieces
$0.20 - $1.00
Quantity
-
+
Shipping
Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
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