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HY880 CPU heatsink thermal paste silicone grease thermal compound
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Shenzhen Halnziye Electronic Co., Ltd.
14 yrs
CN
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Key attributes
Industry-specific attributes
CAS No.
7085-85-0
Other attributes
Place of Origin
Guangdong, China
Main Raw Material
Silicone
Usage
CPU Cooler
Other Names
Thermal Silicone Grease
MF
Mixture
EINECS No.
230-391-5
Classification
Other Adhesives
Brand Name
Halnziye
Model Number
HY880-SP05C
Type
Grease
Thermal conductivity
5.15 W/m-k
Thermal Impendance
0.004 ℃-in2/W
Specific Gravity
3.25
Viscosity
12500
Thixotropic Index
280
Moment Bore Temperature
-50~340 ℃
Operation Temperature
-30~280 ℃
Color
Grey
Ingrediate
SILICONE/CARBON/METAL OXIDE COMPOUNDS
Applications
CPU&VGA COOLER&LED HEAT SINK
Packaging and delivery
Packaging Details
mini package /OEM&ODM package
Port
Shenzhen & Hongkong
Supply Ability
Supply Ability
40000 Piece/Pieces per Week
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Shenzhen Halnziye Electronic Co., Ltd.
14
Located in CN
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Product descriptions from the supplier
Minimum order quantity: 200 pieces
$0.035 - $0.045
Quantity
-
+
Shipping
Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
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