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      25mm Bga Lead-Free SolderTin Ball Silver Ball Soldering Sn99.98% silver solder

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      Shenzhen Xinghongtai Tin Co., Ltd.6 yrsCN

      Key attributes

      Other attributes

      Material
      tin

      Certification
      ROHS,REACH,SGS,ISO

      Color
      Silver Grey

      Diameter
      customizable

      Keyword
      BGA solder ball

      Melting Point
      183℃

      serve
      free sample

      Size
      2.381-50.8mm

      Package
      Plastic Bag+Box+Carton

      Application
      BGA PCB welding

      Packaging and delivery

      Packaging Details
      If you need another packing style,we can change the packing according to your request.(ask for us)

      Port
      SHENZHEN

      Supply Ability

      Supply Ability
      1000 Ton/Tons per Month

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      Lead time

      Quantity (kilograms)1 - 10000 > 10000
      Lead time (days)14To be negotiated

      Customization

      Customized logo
      Min. order: 200
      Customized packaging
      Min. order: 200
      Graphic customization
      Min. order: 200
      For more customization details, message supplier
      Minimum order quantity: 2 kilograms
      $8.10 - $24.90

      Variations

      Total options:
      Select now

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