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High Density SIM CARD package IC substrate

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Key attributes

Other attributes

Place of Origin
China

Brand Name
N/A

Model Number
UO-21015A-A

Targrt products
PBGA,FBGA,FMC,SIP,MCP,FCCSP,POP,FCBGA,LGA,etc

Core material
MGC,Doosan,LG,Hitachi,Sumitomo,AMC

SR material
Taiyo,Hitachi,Sumitomo,SanEI

Pattern
Tenting,MSAP,PSAP,ETS,SAP

Soldermask
PSR series

Surface Finish
E'tro-Ni/Au ENIG,ENEPIG OSP(AFOP) Hard Au

Warranty
1 year

Size
Customized

MOQ
20 strips

Brand
No brand

Type
LOGIC ICS

Packaging and delivery

Port
shenzhen

Lead time

Quantity (square meters)1 - 200 > 200
Lead time (days)30To be negotiated

Customization

Customized logo
Min. order: 1
Customized packaging
Min. order: 1
Graphic customization
Min. order: 1

Product descriptions from the supplier

1 - 9 square meters
$9.00
>= 10 square meters
$0.10

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00

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