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IC package substrate for SIM CARD with E'tro-Ni/Au IC substrate
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Zhuhai Fillgold Technology Co., Ltd.
4 yrs
CN
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Key attributes
Other attributes
Place of Origin
China
Brand Name
N/A
Model Number
UO-21015A-A
Targrt products
PBGA,FBGA,FMC,SIP,MCP,FCCSP,POP,FCBGA,LGA,etc
Core material
MGC,Doosan,LG,Hitachi,Sumitomo,AMC
SR material
Taiyo,Hitachi,Sumitomo,SanEI
Pattern
Tenting,MSAP,PSAP,ETS,SAP
Soldermask
PSR series
Surface Finish
E'tro-Ni/Au ENIG,ENEPIG OSP(AFOP) Hard Au
Warranty
1 year
Size
Customized
MOQ
20 strips
Brand
No brand
Packaging and delivery
Port
shenzhen
Selling Units:
Single item
Single package size:
20X20X20 cm
Single gross weight:
0.100 kg
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Lead time
Quantity (square meters)
1 - 200
> 200
Lead time (days)
30
To be negotiated
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Samples
Maximum order quantity: 5 square meter
Sample price:
$5.00/square meter
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20 - 199 square meters
$9.00
>= 200 square meters
$8.00
Variations
Total options:
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Samples
Maximum order quantity: 5 square meter
Sample price:
$5.00/square meter
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